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Interflux DP 5505 : No-clean, Lead-free and Halide-free Solder Paste for SnAgCu, SnCu and SnAg alloys.

Solder paste, aka solder cream, is viscous solder produced by adding flux to powdered solder.

ครีมตะกั่ว (ตะกั่วเหลว อย่างดี) ใช้บัดกรี อุปกรณ์อิเล็กทรอนิกส์แบบไม่มีขา SMD (surface mount device) ลงบนแผ่นวงจรพิมพ์ (PCB) ในโรงงาน อุตสาหกรรม
สูตร: ดีบุก 96.5%, เงิน 3.0%, ทองแดง 0.5% (ไม่มีส่วนประกอบของตะกั่ว)
มีทั้งแบบกระปุก และแบบหลอด. ใช้ประกอบ/ซ่อมโทรศัพท์มือถือ

European Quality, Thai Price.

• Lead-free, Halogen-free. Environmentally friendly. Flux reliability. No corrosion. Can freely use without cleaningใ
• High moisture resistance. Ideal for countries with high humidity like Thailand.
• Low voiding and anti hidden pillow chemistry. Ideal for BGA.
• Good slump resistance. Minimize the risk on bridging, solder beading and solder balling in reflow.
• Good wetting on OSP, HASL, Ni/Au. Good wetting even in air reflow soldering.
• Low residue after reflow. Good cosmetics. I.C.T flying probe testable. ICT pin bed testable. ไม่มีคราบ
• Competitive price in Thai baht. Stock available for door-to-door delivery. ราคาพิเศษ ส่งทั่วไทย

Now available locally in Thailand. Stock available from August 2009.
Please email, fax or call for price and MSDS.

Testimonials

ตะกั่วดี ราคาถูก ใครๆก็ใช้

The DP 5505 solder paste is use by ... ... ...

กรุงเทพฯและปริมณฑล (ปทุมธานี สมุทรปราการ นนทบุรี) ชลบุรี ระยอง

DP 5505 is the next generation lead-free solder paste from Interflux Delphine series.

After the implementation of lead-free processes it was clear that the chemistry in the lead-free era needed to be different from what was used up until then. Using the experience of the first generation lead-free products, market demands and analysis of market feedback, the Delphine DP 5505 carefully combines this acquired knowledge into a high performance product.

DP 5505 is a halide free solder paste for lead free alloys.

• Lead free (RoHS)
• Halogen free (0.0%)
• Flux Classification: ROL0 (J-STD-004A IPC-TM-650 2.3.28.1)

Halogens (Cl,Br,F,I) have the ability to react with lead-free alloys producing conductive and corrosive salt. DP 5505 is halide free providing optimal reliability after soldering.

Key Advantages : A dozen reasons to choose Interflux DP5505 by BK Panit

1. High moisture resistance

DP 5505 has high resistance against moisture and elevated temperatures. Ideal for countries with high humidity like Thailand.


DP 5505 solder paste humidity resistance. 4 hours at 26C & 96%RH prior to reflow.


Competitor solder paste suffering from humidity. 3 hours at 26C & 96%RH prior to reflow resulting in displaced components and flux spatter.

2. Low voiding chemistry

DP 5505 meets IPC-7095A voiding performance class 3. Ideal for BGA.


Low voiding on DP 5505.


Voids on standard paste.

3. Anti hidden pillow defect

This solder paste has been designed to minimize the "hidden pillow" defect on BGAs.


The "hidden pillow" or "head-in-pillow" defect on a ball grid array (BGA) type component as seen in a cross section.

DP 5505 BGA side.DP 5505 PCB side.

BGA peel off after reflow. 22C & 55%RH.

Hidden pillow on BGA side.Hidden pillow on PCB side.

4. Good slump resistance

This solder paste has excellent slump and hot slump properties, minimising the risk on bridging, solder beading and solder balling in reflow.


Pattern A-21. Pre slump.


Pattern A-21. Cold slump: Pass (22C & 55%RH, J-STD-005 IPC-TM-650 2.4.45)


Pattern A-21. Hot slump: Pass (22C & 55%RH, J-STD-005 IPC-TM-650 2.4.45)


Pattern A-20. Hot slump: Pass (22C & 55%RH, J-STD-005 IPC-TM-650 2.4.45)

5. Good wetting on HASL, Ni/Au, OSP Cu, I-Sn, I-Ag

DP 5505 shows excellent wetting and spreading on many board finishes including OSP.


Wetting on oxidized Cu. 105% spread of the printed SAC305 paste.


Wetting and spreading on NiAu. The grey circle is original print deposit area.


Wetting and spreading on Chem Sn. The grey circle is original print deposit area.

6. Low residue after reflow

The residues after reflow are minimal and clear, they are easy to be penetrated by flying probe and ICT test pins. Good cosmetics.

....
Typical residue amount after reflow: <5%.

7. Excellent solder beading resistance

.
Solder beading resistance: Good. (Print speed: 70 mm/sec, Temp = 22C, RH = 53%)

8. Excellent solder balling resistance


Pass as preferred 15min. (J-STD-005 IPC-TM-650 2.4.34, 22C & 55%RH)


Pass as preferred 4hr. (J-STD-005 IPC-TM-650 2.4.34, 22C & 55%RH)

9. Ultra fine pitch capability

High repeatability of the volume of the printed deposit for 0.25mm (10mil) and 0.20mm (8mil) aperture sizes using type 3 size powder.
Repeatable 0201 component aperture printing using type 3 size powder.
Typical under screen cleaner wipe interval up to 10 prints at 0.5mm (20mil) pitch.


Print speed: 70mm/sec, Temperature: 22C, Humidity: 55% R.H., Aperture: 0.25 mm (10mil)


A difference of less than 3% volume deviation was measured. (An abandon time of 1 hour for 0.25mm (10mil) apertures as test condition.)

10. High stability
1. Long abandon time (over 2 hours)

Printer abandon: Boards are printed using a 120?m thick stencil. Before and after each print boards are weighed on high precision scales. This process is repeated after 2 hours of inactivity and values are set out in the graph below.

After a 2 hour period of abandoning the printer and paste, a difference of less than 2% volume deviation was measured for the first print. The 2nd and 3rd print showed a deviation of less than 0.2% which is considered standard process deviation. (Print speed: 70 mm/sec, Temp = 22C, RH = 55%)

2. Long tack and stencil life

Mounting tack time over 8 hours. Stencil life over 8 hours.


Mean deviations measured: Less than 3% over 8 hour (J-STD-005 and IPC-TM-650 2.4.44, 25C & 50%RH)

3. Consistant print volume

Volume consistency: Boards are printed using a 120um thick stencil. Before and after each print boards are weighed on high precision scales. This process is repeated in time and the obtained values are set out in the graph below.

During a 6 hour period of printing, a difference of less than 2% volume deviation was measured. (Print speed: 70 mm/sec, Temp = 22C, RH = 55%)

4. High print speed

Print speed range: Volume variations at different print speeds of the printed paste amount.

Mean deviations measured: 10mm/sec: less than 0.2%, 20mm/sec: less than 0.4%, 35mm/sec: less than 0.4%, 50mm/sec: less than 0.2%, 70mm/sec: less than 0.2% (Temp = 24C, RH = 53%)

5. Wide operating temperature range

Temperature range: Volume deviation variations of the printed paste amount at different temperatures.

At 15C a total deviation of less than 0.6% was measured, at 22C the deviation was less than 0.8% and at 29C the deviation was less than 1.5%. (Print speed: 70 mm/sec, RH = 55%)

11. Long profile capability

DP 5505 has wide process window and easy to use.


Recommended linear and soak profiles for DP 5505 SnAgCu alloy melting point 217C.

12. Suitable for vapour phase soldering

Technical Data

Melting point (SAC305) : 217-219C

Density (for 88% SAC305): >4g/cm3

Printing Performance

Ultra fine pitch capability : Better than 3% difference in repeatability on combined 0.25mm (10mil) and 0.20mm (8mil) round apertures

Volume consistency : Less than 2% difference after 6 hours of regular printing

Printer abandon : Less than 2% difference after 2 hours

Temperature range : Excellent performance between 15C and 29C

Print speed range : 20 mm/sec to 150 mm/sec

Reflow performance

Humidity resistance : Pass 4 hours at 26C and 96% RH prior to reflow (have no effect on reflow of mounted boards)

Voiding : Pass (IPC-7095A class 1,2,3 requirements)

Solder beading : Excellent performance

Solder ball test after 15min : Pass (J-STD-005 IPC-TM-650 2.4.43)

Solder ball test after 4hr : Pass (J-STD-005 IPC-TM-650 2.4.43)

Wetting test : Pass (J-STD-005 IPC-TM-650 2.4.45)

Slump test after 15min at 25C : Pass (J-STD-005 IPC-TM-650 2.4.35)

Slump test after 10min at 150C : Pass (J-STD-005 IPC-TM-650 2.4.35)

Residue/cosmetics : Excellent performance

Test results (conform to IPC J-STD-004A / J-STD-005)

Qualitative copper mirror : pass (J-STD-004A IPC-TM-650 2.3.32)

Halide Content : 0.0% (J-STD-004A IPC-TM-650 2.3.28.1)

Silver chromate (Cl, Br) : pass (J-STD-004A IPC-TM-650 2.3.33)

Flux classification : ROL0 (J-STD-004A IPC-TM-650 2.3.28.1)

SIR test : pass (J-STD-004A IPC-TM-650 2.6.3.3)

Availability

Alloy

• SAC305: Sn96.5Ag3Cu0.5 ***
• SAC387: Sn95.5Ag3.8Cu0.7
• SAC405: Sn95.5Ag4Cu0.5
• SnAg: Sn96.5Ag3.5
• SnAg: Sn95.8Ag4.2
• SnCu: Sn99.3Cu0.7

Metal content

• Printing: 88.5%
• Dispensing: 85%

Powder size

• Standard type 3 (25—45u)
• Other sizes upon request

Packaging

• 500g jar
• 1kg, 1,2kg, 1,3kg in 12oz cartridge
• 5cc, 10cc, 30cc syringe
• Other packagings upon request

Guidelines

Storage

Reuse

Handling

Printing

Assure good sealing between PCB and stencil. Apply no more than enough squeegee pressure to get a clean stencil. Apply enough solder paste to the stencil to allow smooth rolling during printing. Regular replenish fresh solder paste. Set an under stencil clean interval which provides continuous printing quality (around 10-20 panels).

• Speed : 20-150 mm/sec
• Squeegee pressure : 250g-350g/cm
• U.S.C. interval : every 10 boards
• Temperature range : 15C to 25C

Profile recommendations (SnAgCu, SnCu and SnAg type alloys)

Preheat: From room temperature until about 200C at a rate of 1-3C/sec. Higher heating rates could result in component cracking due to absorbed moisture.

Soak: From 180C to about 200C at a rate of 0.5-1C/sec. In some cases a temperature holding soak zone is used to level out differences on a board. It is often used on high mix boards or to reduce voids in certain lead free processes. To reduce voids a 30 to 90 sec soak between 180C and 200C is recommended.

Reflow: Peak temperature used is related to component specifications. Minimum 10C over alloy melting point is advised. In general between 235C and 250C. The time in liquidus (over melting point of the alloy used) between 45 seconds and 90 seconds.

Cooling: Cooling rate around -4C/sec because of differences in thermal expansion of different materials.

มีของพร้อมส่ง

halogen: chlorine, bromine, fluorine, iodine